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Novel copper cooler based on microstructure architecture. The water flows into this microstructure above the DIE (core of the CPU). In addition, the copper pins of the cooler are glass blasted in order to further increase the surface of the cooler.
The cooler has been developed to meet highest requirements combined with a very good cost/performance ratio. The plexiglas cover and the copper cooler itself are sealed with a long-live O-ring |
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watercooled cases
complete kits
